Mechanical Planarization Technology. Current Status and Future Challenges in Endpoint Detection Technique for Mechanical Planarization Process.

Damascene Process and Chemical Mechanical Planarization )e

The constant demand to scale down transistors and improve device performance has led to material as well as process changes in the formation of IC interconnect. Traditionally, aluminum has been used to form the IC interconnects. The process involved subtractive etching of blanket aluminum as defined by the patterned photo resist. However, the scaling and performance demands have led to transiti...

Damascene Process and Chemical Mechanical Planarization

A Two-Dimensional Process Model for Chemi-Mechanical Polish Planarization

As device sizes are scaled to sub-micron dimensions, planarization technology becomes increasingly important, both for bipolar and CMOS trench isolation and for multi-level interconnects and wiring. Although chemi-mechanical polishing (CMP) has been used extensively in silicon technology for wafer preparation[l,2], it is only recently that CMP has emerged as a new technique for achieving a high...

Laser Assisted Chemical Mechanical Polishing for Planarization

Cu Electrochemical Mechanical Planarization Surface Quality

Cu Electrochemical Mechanical Planarization Surface Quality Abhinav Tripathi, Ian Ivar Suni,* Yuzhuo Li, Francois Doniat, and James McAndrew* Department of Chemical and Biomolecular Engineering and Department of Chemistry and Biomolecular Science, Center for Advanced Materials Processing, Clarkson University, Potsdam, New York 13699, USA American Air Liquide, Delaware Research and Technology Ce...